Solution: Discrete & Power Devices

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.