Solution: Sensors & Transducers

DV-Prime & Da Vinci Product Families

Spin Wet Clean

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Kiyo Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

SP Series Product Family

Spin Wet Clean

This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.

SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Syndion Product Family

DRIE Reactive Ion Etch

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

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