Process: Strip & Clean

These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Lam’s advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.

This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.