EOS Product Family

EOS Product Family


Wet wafer cleaning is used between chip-processing steps to remove yield-limiting residues and defects. Continued device scaling, increasingly complex structures, and new materials bring additional defect removal challenges and also drive the need for increased wafer clean productivity.

As the latest of Lam’s wet clean products, EOS® delivers exceptionally low on-wafer defectivity and high throughput to address progressively demanding wafer cleaning applications, including emerging 3D structures.

Industry Challenges

Wafer cleaning is a critical function that must be repeated many times during semiconductor manufacturing. As device geometries shrink below 10 nm and new materials are introduced, the number of cleaning steps continues to grow at an aggressive rate. Increasingly complicated cleaning processes are driving longer process times and the need for greater overall productivity. Advanced cleaning capabilities are needed to address additional technical challenges. For example, multiple patterning approaches require collapse-free drying and damage-free particle removal. Cleaning processes that tightly control material loss are critical for FinFET, 3D NAND, and other 3D structures.


  • Low defectivity enabled by advanced chamber design
  • Optimized high throughput with up to 16 process chambers
  • Lean-free drying for high-aspect ratio structures
  • High-efficiency, damage-free particle removal with proprietary technology
  • Within-wafer uniformity tuning to control material loss with unique dispensing technology

Product Offerings

  • EOS®


  • Particle, polymer, and residue removal
  • Photoresist removal
  • Backside/bevel cleaning and film removal