Versys Metal Product Family

Products

Reactive Ion Etch (RIE)

Advanced Memory, Analog & Mixed Signal, Discrete & Power Devices, Interconnect, Packaging, Patterning

Metal etch processes play a key role in connecting the individual components that form an integrated circuit (IC), such as forming wires and electrical connections. These processes are also used to drill through the metal hardmasks (MHM) that are used to pattern features too small for conventional masks, thereby allowing continued shrinking of feature dimensions.

To enable performing these critical etch steps, Lam’s Versys^® Metal product family provides high-productivity capability on a flexible platform. For some applications, select models are also available through our Reliant™ Systems as refurbished products, providing lower cost of ownership with the same quality assurance and performance as new systems.

Industry Challenges

For back-end-of-line (BEOL) metal etch, semiconductor manufacturers are focused on the challenges of achieving repeatable profile and critical dimension (CD) control as well as maintaining high-volume, low-cost production. While metal hardmasks facilitate BEOL integration by increasing selectivity to low-k dielectric films, they also introduce new challenges, such as the need to control trench dimension and bottom line roughness. Etch technologies that provide process tunability without compromising productivity are needed to meet the needs of hardmask and other BEOL metal etch applications.

KEY CUSTOMER BENEFITS

Superior CD, profile uniformity, and uniformity control enabled by a symmetrical chamber design with independent process tuning features
High availability, high yield, and exceptional process repeatability with proprietary chamber cleaning technology
Upgradable products for low cost of ownership over several device generations

Product Offerings

Versys^® Metal
Versys^® Metal45™
Versys^® Metal L
Versys^® Metal M

KEY APPLICATIONS

TiN metal hardmask
High-density aluminum line
Aluminum pad