Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)
Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.
Plasma Bevel Clean
These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.
These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.
Lam’s advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.
Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)
Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.
These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.
Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
Lam’s mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.
Reliant Systems Wet Clean/Strip/Etch
Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.
Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems
Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.