Solution: Packaging

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

These products deliver exceptional process control at high productivity for several critical and non-critical deep silicon etch applications.

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Lam’s mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

Using Lam’s proven Electrofill technology, these high-productivity systems deliver quality metal films for advanced packaging applications.

This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.