Solution: Packaging

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.