MyLam

Solution: Interconnect

ALTUS Product Family

Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

Advanced Memory, Interconnect, Packaging, Transistor
Coronus Product Family

Plasma Bevel Clean

These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.

Advanced Memory, Interconnect, Patterning, Transistor
DV-Prime & Da Vinci Product Families

Spin Wet Clean

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Analog & Mixed Signal, Discrete & Power Devices, Interconnect, Optoelectronics & Photonics, Packaging, Patterning, Sensors & Transducers, Transistor
EOS Product Family

Spin Wet Clean

Lam’s advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Advanced Memory, Interconnect, Patterning, Transistor
Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Advanced Memory, Analog & Mixed Signal, Discrete & Power Devices, Interconnect, Optoelectronics & Photonics, Packaging, Patterning, Transistor
GAMMA Product Family

Dry Strip

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Advanced Memory, Interconnect, Patterning, Transistor
Kiyo Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Advanced Memory, Analog & Mixed Signal, Discrete & Power Devices, Interconnect, Patterning, Sensors & Transducers, Transistor
SABRE Product Family

Electrochemical Deposition (ECD)

This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.

Advanced Memory, Interconnect
SOLA Product Family

Ultraviolet Thermal Processing (UVTP)

This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.

Interconnect, Transistor
SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Advanced Memory, Discrete & Power Devices, Interconnect, Optoelectronics & Photonics, Sensors & Transducers, Transistor
circle-arrow2circle-arrow2facebookgooglehandshake2health2linkedinmenupdfplant2searchtwitteryoutube