MyLam

Solution: Interconnect

Syndion Product Family

DRIE Reactive Ion Etch

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

Interconnect, Packaging, Sensors & Transducers
VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Advanced Memory, Analog & Mixed Signal, Discrete & Power Devices, Interconnect, Optoelectronics & Photonics, Packaging, Patterning, Sensors & Transducers, Transistor
Versys Metal Product Family

Reactive Ion Etch

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.

Advanced Memory, Analog & Mixed Signal, Discrete & Power Devices, Interconnect, Packaging, Patterning
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