Solution: Packaging

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Using Lam’s proven Electrofill technology, these high-productivity systems deliver quality metal films for advanced packaging applications.

This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.