Solution: Transistor

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Lam’s advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.