Solution: Sensors & Transducers
DV-Prime & Da Vinci Product Families
Spin Wet Clean
These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.
Kiyo Product Family
Atomic Layer Etch (ALE) Reactive Ion Etch
Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
SP Series Product Family
Spin Wet Clean
This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.
SPEED Product Family
High-Density Plasma Chemical Vapor Deposition (HDP-CVD)
These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.
Syndion Product Family
DRIE Reactive Ion Etch
For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.
VECTOR Product Family
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.